Office: 155 Everitt Laboratory
     Department of Electrical and Computer Engineering
     University of Illinois at Urbana-Champaign
     Urbana, IL 61801-2991
Phone: 217-333-6037
Fax: 217-333-5962
Email: cangella@staff.uiuc.edu


Professor Cangellaris' research work has been in the area of applied and computational electromagnetics with emphasis on their application to electrical modeling and simulation of RF/microwave components and systems, high-speed digital interconnects at the board, package, and chip level, as well as the modeling and simulation of electromagnetic compatibility and electromagnetic interference.

He has co-authored more than 200 refereed papers in journals and conference proceedings and three book chapters on topics related to computational electromagnetics, interconnects and package electrical/electromagnetic modeling, and distributed circuit transient simulation.

He has also co-authored with Dr. Yu Zhu a book on "Multigrid Finite Element Methods for Electromagnetic Field Modeling," IEEE Press, John Wiley & Sons, 2006.

Several electromagnetic software modules developed in Prof. Cangellaris' group are available for password-controlled download (contact Prof. Cangellaris (cangella@uiuc.edu) for access information):

EVERGREEN: Calculates the electrodynamic Green's function for an electric field dipole in multi-layer, planar, lossy dielectrics. A special attribute of this tool is the ability to calculate the Green's dyad with high accuracy over a very broad range of frequencies. (Unlimited distribution)

UIUC2D: This two-dimensional electro-quasi-static and magneto-quasi-static field solver is streamlined for the extraction of multi-conductor transmission line R(f),L(f),C,G(f) matrices for multiple, coupled interconnects, accounting for conductor and dielectric loss. (Distribution limited to Semiconductor Corporation member companies and DARPA NeoCAD Program participants.)

EM-Cafe: This is a three-dimensional finite element electrodynamic solver, streamlined for the broadband analysis of three-dimensional waveguding structures encountered in printed-circuit boards and electronic packages. The solver utilizes Krylov subspace methods for expedient broadband electromagnetic analysis overmulti-GHz bandwiths. (Distribution limited to SRC member companies.)

 

 

 

 




    

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