| Office: | 155 Everitt Laboratory |
| Department of Electrical and Computer Engineering | |
| University of Illinois at Urbana-Champaign | |
| Urbana, IL 61801-2991 | |
| Phone: | 217-333-6037 |
| Fax: | 217-333-5962 |
| Email: | cangella@staff.uiuc.edu |
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Professor Cangellaris' research work has been in the area of applied and computational electromagnetics with emphasis on their application to electrical modeling and simulation of RF/microwave components and systems, high-speed digital interconnects at the board, package, and chip level, as well as the modeling and simulation of electromagnetic compatibility and electromagnetic interference. He has co-authored more than 200 refereed papers in journals and conference proceedings and three book chapters on topics related to computational electromagnetics, interconnects and package electrical/electromagnetic modeling, and distributed circuit transient simulation. He has also co-authored with Dr. Yu Zhu a book on "Multigrid Finite Element Methods for Electromagnetic Field Modeling," IEEE Press, John Wiley & Sons, 2006. Several electromagnetic software modules developed in Prof. Cangellaris' group are available for password-controlled download (contact Prof. Cangellaris (cangella@uiuc.edu) for access information): EVERGREEN: Calculates the electrodynamic Green's function for an electric field dipole in multi-layer, planar, lossy dielectrics. A special attribute of this tool is the ability to calculate the Green's dyad with high accuracy over a very broad range of frequencies. (Unlimited distribution) UIUC2D: This two-dimensional electro-quasi-static and magneto-quasi-static field solver is streamlined for the extraction of multi-conductor transmission line R(f),L(f),C,G(f) matrices for multiple, coupled interconnects, accounting for conductor and dielectric loss. (Distribution limited to Semiconductor Corporation member companies and DARPA NeoCAD Program participants.) EM-Cafe: This is a three-dimensional finite
element electrodynamic solver, streamlined for the broadband analysis
of three-dimensional waveguding structures encountered in printed-circuit
boards and electronic packages. The solver utilizes Krylov subspace
methods for expedient broadband electromagnetic analysis overmulti-GHz
bandwiths. (Distribution limited to SRC member companies.)
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